Invention Grant
- Patent Title: Heat dissipation structure, method for making the same, and electronic device having the same
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Application No.: US15615065Application Date: 2017-06-06
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Publication No.: US10658265B2Publication Date: 2020-05-19
- Inventor: Fu-Yun Shen , Cong Lei , Ming-Jaan Ho , Hsiao-Ting Hsu
- Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Applicant Address: CN Shenzhen CN Qinhuangdao
- Assignee: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Current Assignee: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Current Assignee Address: CN Shenzhen CN Qinhuangdao
- Agency: ScienBiziP, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5c9d6d4e
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/36 ; H01L23/427 ; H01B17/54 ; H05K7/20 ; H01B7/42
Abstract:
A heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The graphite sheet is connected to the second surface. At least one containing cavity is defined on an interface between the second surface and the graphite sheet. The heat insulating material is filled in the at least one containing cavity to form a heat insulating structure.
Public/Granted literature
- US20180082924A1 HEAT DISSIPATION STRUCTURE, METHOD FOR MAKING THE SAME, AND ELECTRONIC DEVICE HAVING THE SAME Public/Granted day:2018-03-22
Information query
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