Invention Grant
- Patent Title: Metal cored solder decal structure and process
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Application No.: US15896480Application Date: 2018-02-14
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Publication No.: US10658267B2Publication Date: 2020-05-19
- Inventor: Peter A. Gruber , Jae-Woong Nah
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel Morris, Esq.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/48 ; H01L23/00 ; B23K3/06 ; B23K1/00 ; B23K26/384 ; B23K26/40 ; B23K26/382 ; B23K101/42 ; B23K103/16 ; H01L23/498 ; H01L21/48 ; H01L23/14

Abstract:
A system of producing metal cored solder structures on a substrate includes: a decal, a carrier, and receiving elements. The decal includes one or more apertures each of which is tapered from a top surface to a bottom surface thereof. The carrier is positioned beneath the bottom of the decal and includes cavities in a top surface. The cavities are located in alignment with the apertures of the decal. The decal is positioned on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities. The feature cavities are shaped to receive one or more metal elements and are configured for receiving molten solder cooled in the cavities. The decal is separable from the carrier to partially expose metal core solder contacts. The receiving elements receive the metal core solder contacts thereon.
Public/Granted literature
- US20180174949A1 METAL CORED SOLDER DECAL STRUCTURE AND PROCESS Public/Granted day:2018-06-21
Information query
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