Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US16153999Application Date: 2018-10-08
-
Publication No.: US10658359B2Publication Date: 2020-05-19
- Inventor: Koji Tanaka , Fumihito Masuoka
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2210e8c7
- Main IPC: H01L27/07
- IPC: H01L27/07 ; H01L29/66 ; H01L29/417 ; H01L29/49 ; H01L29/739 ; H01L29/861 ; H01L29/16 ; H01L29/20

Abstract:
A semiconductor device, which is a diode, includes the following: an n cathode layer, which is an n-type region, disposed in a surface layer of a semiconductor substrate; a p cathode layer, which is a p-type region, disposed in the surface layer; and a cathode electrode, which is a metal electrode, in contact with both of the n cathode layer and the p cathode layer. The cathode electrode includes a first metal layer in contact with both of the n cathode layer and the p cathode layer, and a second metal layer disposed on the first metal layer. A contact surface between the first metal layer and the second metal layer has an oxygen concentration lower than the oxygen concentration of a contact surface between the first metal layer, and the n cathode layer and the p cathode layer.
Public/Granted literature
- US20190181138A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-06-13
Information query
IPC分类: