Invention Grant
- Patent Title: Integrated assemblies which include metal-containing interconnects to active-region pillars, and methods of forming integrated assemblies
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Application No.: US16208065Application Date: 2018-12-03
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Publication No.: US10658367B1Publication Date: 2020-05-19
- Inventor: Arzum F. Simsek-Ege
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
Some embodiments include an integrated assembly having active-region-pillars. Each of the active-region-pillars has contact regions. The contact regions include a pair of storage-element-contact-regions, and include a digit-line-contact-region between the storage-element-contact-regions. The active-region-pillars include silicon. Wordlines are along the active-region-pillars and extend along a first direction. Cobalt silicide is directly against the silicon of one or more of the contact regions. Metal-containing material is directly against the cobalt silicide. Digit-lines are electrically coupled with the digit-line-contact-regions and extend along a second direction which crosses the first direction. Storage-elements are electrically coupled with the storage-element-contact-regions. Some embodiments include methods of forming integrated assemblies.
Public/Granted literature
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