Invention Grant
- Patent Title: Solid-state imaging device, manufacturing method thereof, and electronic apparatus
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Application No.: US15122709Application Date: 2016-01-04
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Publication No.: US10658408B2Publication Date: 2020-05-19
- Inventor: Ippei Yoshiba , Yoichi Ootsuka
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7dee9241
- International Application: PCT/JP2016/050015 WO 20160104
- International Announcement: WO2016/114154 WO 20160721
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/369 ; H04N5/3745 ; H04N5/365 ; H04N5/374 ; H04N5/378

Abstract:
The present disclosure relates to a solid-state imaging device, a manufacturing method thereof, and an electronic apparatus, in which both oblique light characteristics and sensitivity can be improved. The solid-state imaging device includes pixel array unit in which a plurality of pixels is two-dimensionally arranged in a matrix and multi-stage light shielding walls are provided between the pixels. The present disclosure is applicable to, for example, a back-illuminated type solid-state imaging device and the like.
Public/Granted literature
- US20170338265A1 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS Public/Granted day:2017-11-23
Information query
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