A film element for driving a display device and a display device using the same are disclosed. The film element includes a film substrate including wirings and pads connected to the wirings, and an IC chip mounted on the film substrate to be connected to the wirings. The pads on the film substrate are grouped into a plurality of areas having different thermal correction amounts. Pads in a second area are closer to the IC chip than pads in a first area. A length of the first area is set to a length obtained by subtracting a first thermal correction amount from a first reference length. A length of the second area is set to a length obtained by subtracting a second thermal correction amount from a second reference length. The second thermal correction amount is smaller than the first thermal correction amount or has a negative value.