Invention Grant
- Patent Title: Direct formation of hexagonal boron nitride on silicon based dielectrics
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Application No.: US16094141Application Date: 2017-04-28
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Publication No.: US10658472B2Publication Date: 2020-05-19
- Inventor: Vikas Berry , Sanjay Behura , Phong Nguyen , Michael R. Seacrist
- Applicant: GlobalWafers Co., Ltd. , Board of Trustees of the University of Illinois
- Applicant Address: TW Hsinchu
- Assignee: GlobalWafers Co., Ltd.
- Current Assignee: GlobalWafers Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Armstrong Teasdale LLP
- International Application: PCT/US2017/030124 WO 20170428
- International Announcement: WO2017/196559 WO 20171116
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/786 ; H01L29/267 ; H01L21/283 ; H01L29/45 ; H01L29/66

Abstract:
A scalable process for fabricating graphene/hexagonal boron nitride (h-BN) heterostructures is disclosed herein. The process includes (BN)XHy-radical interfacing with active sites on silicon nitride coated silicon (Si3N4/Si) surfaces for nucleation and growth of large-area, uniform and ultrathin h-BN directly on Si3N4/Si substrates (B/N atomic ratio=1:1.11±0.09). Further, monolayer graphene van der Waals bonded with the produced h-BN surface benefits from h-BN's reduced roughness (3.4 times) in comparison to Si3N4/Si. Because the reduced surface roughness leads to reduction in surface roughness scattering and charge impurity scattering, therefore an enhanced intrinsic charge carrier mobility (3 folds) for graphene on h-BN/Si3N4/Si is found.
Public/Granted literature
- US20190097000A1 DIRECT FORMATION OF HEXAGONAL BORON NITRIDE ON SILICON BASED DIELECTRICS Public/Granted day:2019-03-28
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