Invention Grant
- Patent Title: Self-aligned gate cut in direct stacked vertical transport field effect transistor (VTFET)
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Application No.: US16173532Application Date: 2018-10-29
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Publication No.: US10658481B1Publication Date: 2020-05-19
- Inventor: Chen Zhang , Tenko Yamashita , Kangguo Cheng , Xin Miao
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/423 ; H01L29/78 ; H01L27/12 ; H01L21/762 ; H01L29/51 ; H01L21/308 ; H01L29/66 ; H01L21/033

Abstract:
Structures and/or methods that facilitate self-aligned gate cut on a dielectric fin extension in direct stacked vertical transport field effect transistor (VTFET). A semiconductor structure can comprise a silicon on insulator (SOI) semiconductor fin comprising a dielectric fin extension. The semiconductor structure can further comprise a first vertical transport field effect transistor (VTFET) comprising a first self-aligned gate on the dielectric fin extension. The semiconductor structure can further comprise a second VTFET comprising a second self-aligned gate on the dielectric fin extension. The semiconductor structure can further comprise a gate contact extending through the dielectric fin extension through the second VTFET to the first self-aligned gate.
Information query
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