Invention Grant
- Patent Title: Unit substrate for optical device and optical device package having same
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Application No.: US16144857Application Date: 2018-09-27
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Publication No.: US10658549B2Publication Date: 2020-05-19
- Inventor: Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
- Applicant: POINT ENGINEERING CO., LTD.
- Applicant Address: KR Asan
- Assignee: POINT ENGINEERING CO., LTD.
- Current Assignee: POINT ENGINEERING CO., LTD.
- Current Assignee Address: KR Asan
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3e6c779e
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/58 ; H01L33/60

Abstract:
Disclosed is a unit substrate for an optical device, the unit substrate including: an optical device-mounting region provided on an upper surface of the unit substrate; and first and second metal substrates bonded to each other with a vertical insulating layer interposed therebetween. A lower surface of the unit substrate is electrically connected to the mounting region, and side and upper surfaces of the unit substrate are electrically isolated from the mounting region such that an optical device is capable of operating in an environment with low electrical resistance.
Public/Granted literature
- US20190097090A1 UNIT SUBSTRATE FOR OPTICAL DEVICE AND OPTICAL DEVICE PACKAGE HAVING SAME Public/Granted day:2019-03-28
Information query
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