Invention Grant
- Patent Title: Vertical resistive processing unit with air gap
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Application No.: US16001515Application Date: 2018-06-06
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Publication No.: US10658582B2Publication Date: 2020-05-19
- Inventor: Takashi Ando , Pouya Hashemi , Choonghyun Lee
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: G11C13/00
- IPC: G11C13/00 ; H01L45/00

Abstract:
A vertical resistive unit is provided. The vertical resistive unit includes first and second resistive random access memory (ReRAM) cells. The first ReRAM cell includes first vertically aligned horizontal electrode layers and first vertical electrodes operably extending through the first vertically aligned horizontal electrode layers. The second ReRAM cell includes second vertically aligned horizontal electrode layers and second vertical electrodes operably extending through the second vertically aligned horizontal electrode layers. The first and second ReRAM cells are disposed to define an air gap between the first and second ReRAM cells.
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