Invention Grant
- Patent Title: Tiered circuit board for interfacing cables and connectors
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Application No.: US15677549Application Date: 2017-08-15
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Publication No.: US10658772B1Publication Date: 2020-05-19
- Inventor: Jared D. Cress , Troy W. White
- Applicant: ADTRAN, INC.
- Applicant Address: US AL Huntsville
- Assignee: ADTRAN, Inc.
- Current Assignee: ADTRAN, Inc.
- Current Assignee Address: US AL Huntsville
- Agency: Maynard, Cooper & Gale, P.C.
- Agent Jon E. Holland
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/02 ; H05K3/34 ; H01R24/50 ; H01R12/72

Abstract:
A connection system has a high-density, high-speed connector that is electrically connected to a plurality of cables by a tiered circuit board. Edges of the circuit board are offset in order to form steps on which conductive pads may be formed. Each set of pads on a given step may be electrically connected to one or more conductors of a cable, such as a twinax ribbon cable. Thus, each of the cables may be coupled to one or more conductive pads on a respective step of the circuit board such that a large number of conductors may be electrically interfaced with the connector in a relatively small space, unencumbered by the bend radius of the cable. In addition, the cables may be coupled to the circuit board in a manner that does not require significant bending at the ends of the cables helping to preserve signal integrity. That is, conductive paths turn at high angles (e.g., close to 90 degrees) within the circuit board rather than at the ends of the cables connected to the circuit board.
Information query