Invention Grant
- Patent Title: Terminal bending tool
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Application No.: US15606056Application Date: 2017-05-26
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Publication No.: US10658807B2Publication Date: 2020-05-19
- Inventor: Zhiyong Dai , Lvhai Hu , Yingcong Deng , Lei Zhou , Yun Liu , Qinglong Zeng , Wei Kang
- Applicant: Tyco Electronics (Shanghai) Co. Ltd. , Shenzhen AMI Technology Co., Ltd
- Applicant Address: CN Shanghai CN Shenzhen
- Assignee: Tyco Electronics (Shanghai) Co. Ltd.,Shenzhen AMI Technology Co., Ltd.
- Current Assignee: Tyco Electronics (Shanghai) Co. Ltd.,Shenzhen AMI Technology Co., Ltd.
- Current Assignee Address: CN Shanghai CN Shenzhen
- Agency: Barley Snyder
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@35c7616d
- Main IPC: H01R43/04
- IPC: H01R43/04 ; H01R43/16 ; H01R12/72 ; B21D7/024

Abstract:
A terminal bending tool comprises a plate, a plurality of receiving grooves, and a plurality of rollers. The plate extends in a first horizontal direction. The receiving grooves are disposed in the plate in a row along the first horizontal direction. The rollers are pivotally mounted in the receiving grooves. A terminal is received and positioned in a first receiving groove and is in contact with an outer circumferential surface of a first roller. When the terminal bending tool is moved in a vertical direction perpendicular to the first horizontal direction, the first roller rotates and moves along a surface of the terminal while pressing and bending the terminal.
Public/Granted literature
- US20170346251A1 Terminal Bending Tool Public/Granted day:2017-11-30
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