Invention Grant
- Patent Title: Optical component, light emitting device using the optical component, and method of manufacturing the optical component
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Application No.: US16129045Application Date: 2018-09-12
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Publication No.: US10658811B2Publication Date: 2020-05-19
- Inventor: Soichiro Miura , Masatsugu Ichikawa , Takehito Shimatsu
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Hunton Andrews Kurth LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@d70fa0
- Main IPC: H01S5/022
- IPC: H01S5/022 ; F21V9/30 ; F21V29/70 ; F21V7/04 ; F21S41/00 ; H01S5/00 ; F21Y115/30 ; H01S5/40

Abstract:
An optical component for optical semiconductor includes a wavelength converting member including a fluorescent part having an upper surface, a lower surface, and one or more lateral surfaces, and containing a fluorescent material, and a light-reflecting part disposed adjacently surrounding the one or more lateral surfaces of the fluorescent part when viewed from above, and a light-transmissive member disposed below the wavelength converting member. A dielectric multilayer film is disposed on an upper surface of the light-transmissive member at least at a region facing the fluorescent part, the dielectric multilayer film is configured to transmit excitation light incident from below the light-transmissive member and to reflect fluorescent light emitted from the fluorescent part. Further, a space is formed between the fluorescent part and the dielectric multilayer film, and the light-reflecting part and the light-transmissive member are connected by a connecting member made of a metal material. A light emitting device including the optical component and a method of manufacturing the optical component are also provided.
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