Invention Grant
- Patent Title: Heat conducting member, printed circuit board, and electronic apparatus
-
Application No.: US16123658Application Date: 2018-09-06
-
Publication No.: US10660194B2Publication Date: 2020-05-19
- Inventor: Masaaki Ito
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@321d3b65
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/34
Abstract:
A heat conducting member includes: a magnetic substance-containing layer containing a magnetic substance, the magnetic substance being oriented along a predetermined orientation direction; and a metal-containing layer containing a metal body including a surface crossing the orientation direction of the magnetic substance.
Public/Granted literature
- US20190075647A1 HEAT CONDUCTING MEMBER, PRINTED CIRCUIT BOARD, AND ELECTRONIC APPARATUS Public/Granted day:2019-03-07
Information query
