A method for measuring a template includes: preparing a measurement wafer and measuring a thickness of the measurement wafer; mounting the template on a reference plane; housing the measurement wafer in the concave portion of the template; measuring heights of the annular member and the measurement wafer from the reference plane in a state where a load is applied to the annular member of the template and the measurement wafer by using a pressing jig; and calculating a depth of the concave portion of the template in the state where the load is applied by using the pressing jig from the measured thickness of the measurement wafer and the heights of the annular member and the measurement wafer. Consequently, it is possible to measure the depth of the concave portion of the template in a state closer to a state during polishing than that realized by a conventional measuring method.