There is disclosed a polishing-surface cleaning apparatus to which a polishing liquid, such as slurry, is less likely to be attached. The polishing-surface cleaning apparatus includes an arm having a fluid passage, a nozzle communicating with the fluid passage, and a weld material securing the nozzle to the arm. The weld material fills a gap between a bottom surface of the arm and an edge of a front-end surface of the nozzle.