Provided is a material for molding, without a mold, a highly uniform structure comprising a resin and a non-resin such as metals and ceramic. The molding material provided by this invention is formed of a powder comprising a resin and at least one species of non-resin selected among metals and ceramic. The resin material has a uniformity index N below 0.2. N is determined by depositting the powder in a softened or melted state to form a structure in a temperature range between the resin material's minimum molding temperature and maximum molding tempeature+100° C.; measuring the structure's porosity Rn at 12 locations by image analysis; and dividing the variance of porosity Rn by the average porosity Rn. The minimum and maximum molding temperatures are the lowest and highest heater temperatures at which the resin material can be molded at a pressure of 3500 psi by injection molding, respectively.