Invention Grant
- Patent Title: Bonded substrate body, method for manufacturing bonded substrate body, liquid discharge head, and method for manufacturing liquid discharge head
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Application No.: US15937580Application Date: 2018-03-27
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Publication No.: US10661566B2Publication Date: 2020-05-26
- Inventor: Yoshiyuki Fukumoto , Atsunori Terasaki , Ryoji Kanri , Atsushi Hiramoto
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A. Inc., IP Division
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@98acc61
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B81C3/00 ; B81C1/00 ; B81B1/00 ; B81B3/00 ; B41J2/045 ; C23C16/455 ; C23C16/40
Abstract:
A method for manufacturing a bonded substrate body in which an end portion of an adhesive is located at a position retreated in a direction to the inside of the bonded substrate body from an end surface of a bonding region of a first substrate and a second substrate includes forming a film on the end portion of the adhesive.
Public/Granted literature
Information query
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