Invention Grant
- Patent Title: Printheads and methods of fabricating a printhead
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Application No.: US15748848Application Date: 2015-10-26
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Publication No.: US10661567B2Publication Date: 2020-05-26
- Inventor: Michael W. Cumbie , Chien-Hua Chen , Mark H. MacKenzie , Garrett E. Clark
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Hanley, Flight & Zimmerman LLC
- International Application: PCT/US2015/057389 WO 20151026
- International Announcement: WO2017/074302 WO 20170504
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/155 ; B41J2/175

Abstract:
Printheads and methods of fabricating printheads are disclosed. An example printhead includes a substrate and a printhead die disposed on a surface of the substrate, where a top surface of the printhead die projects a first distance from the surface of the substrate. The example printhead also includes a barrier at least partially surrounding the printhead die. A top surface of the barrier projects a second distance from the surface of the substrate, where the first distance is less than the second distance.
Public/Granted literature
- US20180222201A1 PRINTHEADS AND METHODS OF FABRICATING A PRINTHEAD Public/Granted day:2018-08-09
Information query
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