Invention Grant
- Patent Title: Heat pump cycle
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Application No.: US15546492Application Date: 2016-02-04
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Publication No.: US10661631B2Publication Date: 2020-05-26
- Inventor: Hiroaki Kawano
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya, Aichi-pref.
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya, Aichi-pref.
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@47f5899a
- International Application: PCT/JP2016/053383 WO 20160204
- International Announcement: WO2016/129498 WO 20160818
- Main IPC: B60H1/00
- IPC: B60H1/00 ; F25B41/04 ; F25B41/00 ; F25B49/02 ; B60H1/22 ; B60H1/32 ; F25B6/04 ; F25B5/04

Abstract:
A heat pump cycle includes a compressor, a first interior heat exchanger, a separator that separates a refrigerant discharged from the compressor into a gas-phase refrigerant which does not include a lubricant and a remaining refrigerant, an exterior heat exchanger that performs heat exchange between the remaining refrigerant flowing out of the separator and an outside air, a second interior heat exchanger, a control valve, an accumulator, and a first bypass passage that bypasses the second interior heat exchanger and connects to an inlet side of the accumulator. The heat pump cycle heats an air flow in the first interior heat exchanger and controls the control valve to reduce the pressure of the refrigerant, in a state where the refrigerant circulates in a refrigerant circuit including the first bypass passage while accumulating the gas-phase refrigerant flowing out of the separator in the second interior heat exchanger.
Public/Granted literature
- US20180022185A1 HEAT PUMP CYCLE Public/Granted day:2018-01-25
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