Invention Grant
- Patent Title: Blister packages
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Application No.: US15106906Application Date: 2014-12-23
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Publication No.: US10661960B2Publication Date: 2020-05-26
- Inventor: Paula Cojocaru , Francesco Maria Triulzi , Marco Apostolo
- Applicant: SOLVAY SPECIALTY POLYMERS ITALY S.P.A.
- Applicant Address: IT Bollate (Milan)
- Assignee: SOLVAY SPECIALTY POLYMERS ITALY S.P.A.
- Current Assignee: SOLVAY SPECIALTY POLYMERS ITALY S.P.A.
- Current Assignee Address: IT Bollate (Milan)
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2bc279f3
- International Application: PCT/EP2014/079124 WO 20141223
- International Announcement: WO2015/097208 WO 20150702
- Main IPC: B65D75/36
- IPC: B65D75/36 ; A61J1/03 ; C23C18/16 ; B32B27/08 ; B32B27/30 ; B32B27/32 ; B32B3/30 ; B65D65/38 ; C23C18/22 ; C23C18/48 ; C23C28/04 ; C25D5/54 ; B32B38/00

Abstract:
The present invention pertains to a process for packaging one or more products, said process comprising the following steps: (i) providing a package having an opening, said package comprising at least one sheet, said sheet comprising the following layers: a layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of, at least one thermoplastic polymer [polymer (T1)], said layer (L1) having two opposite surfaces, wherein one surface comprises one or more grafted functional groups [surface (L1-S1-f)], directly adhered to the surface (L1-S1-f), a layer [layer (L2)] consisting of at least one metal compound [compound (M1)], and optionally, directly adhered to the layer (L2), a layer (L3) consisting of a composition [composition (C3)] comprising, preferably consisting of at least one thermoplastic polymer [polymer (T2)], said polymer (T2) being equal to or different from the polymer (T1); (ii) feeding the package provided in step (i) with one or more products; and (iii) sealing the package provided in step (ii). The present invention also pertains to said package, to a process for the manufacture of said package and to uses of said package in various applications.
Public/Granted literature
- US20170001781A1 BLISTER PACKAGES Public/Granted day:2017-01-05
Information query
IPC分类: