Invention Grant
- Patent Title: Processing aid
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Application No.: US16271486Application Date: 2019-02-08
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Publication No.: US10662324B2Publication Date: 2020-05-26
- Inventor: Ken Okanishi , Yoshichika Komiya , Takafumi Yamato , Tsuyoshi Miyamori
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@941cbbc
- Main IPC: C08L23/02
- IPC: C08L23/02 ; C08L27/12 ; C08J3/22 ; C08F259/08 ; C08F293/00 ; C08K3/26 ; C08K3/34 ; C08L71/02 ; C08L23/08

Abstract:
The invention provides a processing aid enabling short-time disappearance of melt fracture occurred in extrusion-molding a melt-fabricable resin at a high shear rate, a great reduction in extrusion pressure, and production of molded articles with good appearance. The processing aid contains a polymer containing a fluorine-containing elastomeric polymer segment and a fluorine-containing non-elastomeric polymer segment.
Public/Granted literature
- US20190177525A1 PROCESSING AID Public/Granted day:2019-06-13
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