Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method using the same
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Application No.: US15838517Application Date: 2017-12-12
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Publication No.: US10662528B2Publication Date: 2020-05-26
- Inventor: Jeong Min Lee , Jin Pil Heo , Tae Ho Jeon , Seung Han Lee , Byoung Guk Son
- Applicant: WONIK IPS CO., LTD.
- Applicant Address: KR Pyeongtaek-si, Gyeonggi-do
- Assignee: WONIK IPS CO., LTD.
- Current Assignee: WONIK IPS CO., LTD.
- Current Assignee Address: KR Pyeongtaek-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7c1335b9
- Main IPC: C23C16/44
- IPC: C23C16/44 ; C23C16/455 ; H01L21/02
Abstract:
Provided are a substrate processing apparatus and a substrate processing method using the same and, more particularly, a substrate processing apparatus capable of controlling deposition of a reactive-metal-containing precursor in an exhaust line, and a substrate processing method using the same.
Public/Granted literature
- US20180163303A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME Public/Granted day:2018-06-14
Information query
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