Invention Grant
- Patent Title: Heat pump apparatus
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Application No.: US15307846Application Date: 2015-03-13
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Publication No.: US10663179B2Publication Date: 2020-05-26
- Inventor: Yasuhiro Suzuki
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@23777cc5
- International Application: PCT/JP2015/057433 WO 20150313
- International Announcement: WO2015/190144 WO 20151217
- Main IPC: F24F1/0007
- IPC: F24F1/0007 ; F24D15/04 ; F25B47/02 ; F25B30/02 ; F24F11/36

Abstract:
A heat pump apparatus includes a refrigerant circuit for circulating combustible refrigerant, and a load unit to be provided in a room and configured to accommodate a load side heat exchanger. The load side heat exchanger allows heat exchange between the combustible refrigerant and a liquid heat medium. The load unit includes a fan, an air inlet for sucking in air from the room, and an air outlet for blowing out the air, sucked in from the air inlet, to the room. The air outlet is provided at a position of a height different from the height of the air inlet.
Public/Granted literature
- US20170059185A1 HEAT PUMP APPARATUS Public/Granted day:2017-03-02
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