Invention Grant
- Patent Title: Input module wiring structure of electronic device
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Application No.: US15650723Application Date: 2017-07-14
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Publication No.: US10664023B2Publication Date: 2020-05-26
- Inventor: Tae Sik Kim , Myung Jae Jo , Hye Won Kang , Ja Myeong Koo , Mu Jin Kim , Jeong Woon Koo , Dae Heon Kwon , Sei Neu Park , Won Hyun Park , Jae Young Yun
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2ce0d31b
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K3/34 ; H05K1/18 ; H05K1/02 ; G06F1/18 ; G06F1/16 ; G06F3/044

Abstract:
An electronic device includes a bracket having a through hole, a first circuit board and a second circuit board which are disposed below the bracket. The second circuit board is electrically connected with the first circuit board, and a first module and a second module are disposed above the bracket. The first module and the second module are electrically connected with the first circuit board via a wiring structure passing through the through hole.
Public/Granted literature
- US20180017999A1 INPUT MODULE WIRING STRUCTURE OF ELECTRONIC DEVICE Public/Granted day:2018-01-18
Information query