Invention Grant
- Patent Title: Machine learning apparatus, laser machining system and machine learning method
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Application No.: US15460850Application Date: 2017-03-16
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Publication No.: US10664767B2Publication Date: 2020-05-26
- Inventor: Hiroshi Takigawa , Akinori Ohyama
- Applicant: FANUC CORPORATION
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: RatnerPrestia
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@19fe3da1
- Main IPC: G06N20/00
- IPC: G06N20/00 ; B23K26/08 ; B23K26/21 ; B23K26/38 ; G06N3/00 ; G06N3/08 ; B23K26/70 ; B23K26/03

Abstract:
A machine learning apparatus that learns laser machining condition data of a laser machining system includes: a state amount observation unit that observes a state amount of the laser machining system; an operation result acquisition unit that acquires a machined result of the laser machining system; a learning unit that receives an output from the state amount observation unit and an output from the operation result acquisition unit, and learns the laser machining condition data in association with the state amount and the machined result of the laser machining system; and a decision-making unit that outputs laser machining condition data by referring to the laser machining condition data learned by the learning unit.
Public/Granted literature
- US20170270434A1 MACHINE LEARNING APPARATUS, LASER MACHINING SYSTEM AND MACHINE LEARNING METHOD Public/Granted day:2017-09-21
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