Invention Grant
- Patent Title: Hard drive module and hard drive removable enclosure thereof
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Application No.: US16255638Application Date: 2019-01-23
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Publication No.: US10665269B1Publication Date: 2020-05-26
- Inventor: William Shen
- Applicant: Super Micro Computer Inc.
- Applicant Address: US CA San Jose
- Assignee: SUPER MICRO COMPUTER INC.
- Current Assignee: SUPER MICRO COMPUTER INC.
- Current Assignee Address: US CA San Jose
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: H05K5/00
- IPC: H05K5/00 ; G11B33/02

Abstract:
A hard drive module includes a hard drive and a hard drive removable enclosure. The hard drive includes a bottom surface having a first securement hole formed to indent inward thereon and a lateral surface having a second securement hole formed to indent inward thereon. The second securement hole is fluidly connected to the first securement hole. The bottom surface of the hard drive is received on a carrier plate. A primary positioning pin penetrates into the first securement hole from the bottom surface of the hard drive. A hook penetrates into the second securement hole from the internal of the first securement hole. Accordingly, by using the primary positioning pin with its rear end formed of the hook thereon for securing the hard drive, the hard drive can be installed and secured inside the hard drive removable enclosure without the use of any tools.
Information query