Invention Grant
- Patent Title: Electronic sub-assembly and method for the production of an electronic sub-assembly
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Application No.: US15564626Application Date: 2016-03-07
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Publication No.: US10665389B2Publication Date: 2020-05-26
- Inventor: Martin Haug , Dragan Dinulovic
- Applicant: Würth Elektronik eiSos GmbH & Co. KG
- Applicant Address: DE Waldenburg
- Assignee: Würth Elektronik eiSos GmbH & Co. KG
- Current Assignee: Würth Elektronik eiSos GmbH & Co. KG
- Current Assignee Address: DE Waldenburg
- Agency: Boyle Fredrickson S.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2cea3d2
- International Application: PCT/EP2016/054777 WO 20160307
- International Announcement: WO2016/162153 WO 20161013
- Main IPC: H01F41/04
- IPC: H01F41/04 ; H01F27/255 ; H01F17/00 ; H01F27/29 ; H01F17/04 ; H01F27/28 ; H01F27/40 ; H01F41/02 ; H01F41/06
Abstract:
An electronic component that includes at least one main body composed of ferrite material, at least one coil embedded in the main body, and at least one conductor track which runs on a side of the main body from a bottom side to a top side of the main body configured such that the main body has at least two side surfaces which enclose an angle of less than 180 angular degrees, where the conductor track is arranged in a recess at the transition between the two side surfaces.
Public/Granted literature
- US20180090269A1 Electronic Sub-Assembly And Method For The Production Of An Electronic Sub-Assembly Public/Granted day:2018-03-29
Information query
