Invention Grant
- Patent Title: Bending device for a wire
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Application No.: US15835690Application Date: 2017-12-08
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Publication No.: US10665390B2Publication Date: 2020-05-26
- Inventor: Daiki Yamaguchi , Tsuyoshi Matsuo
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: JP Toyota
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7704758f
- Main IPC: H01F41/077
- IPC: H01F41/077 ; H02K15/04 ; H01F41/082 ; B21D11/06 ; B21F3/02

Abstract:
A bending device for a wire includes a holder including a stepped part, the stepped part includes a side-surface corner and a flat surface, and the side-surface corner includes a curved surface. The bending device includes a guide member configured to push the wire against and along the curved surface, and the guide member revolves around a rotational axis of the guide member. The rotational axis of the guide member is disposed on a same axis as a center of the circle defining the curved surface of the holder.
Public/Granted literature
- US20180182544A1 BENDING DEVICE FOR A WIRE Public/Granted day:2018-06-28
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