Invention Grant
- Patent Title: Substrate processing apparatus
-
Application No.: US16039446Application Date: 2018-07-19
-
Publication No.: US10665416B2Publication Date: 2020-05-26
- Inventor: Shinji Kubota , Naohiko Okunishi , Yosuke Tamuro , Shota Kaneko
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Main IPC: H01J37/06
- IPC: H01J37/06 ; H01J3/02 ; H01J37/32

Abstract:
A substrate processing apparatus includes a chamber, a pedestal provided in the chamber and having a substrate holding region to hold a substrate thereon, and a gas supply part to supply a gas into the chamber. A plurality of electron gun arrays two-dimensionally arranged so as to cover the substrate holding region is provided and configured to emit electrons toward the gas to cause interactions between the emitted electrons and the gas. A plurality of electron energy control parts is correspondingly provided at each of the electron gun arrays and configured to control energy of the electrons emitted from each of the electron gun arrays independently of each other.
Public/Granted literature
- US20200027688A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2020-01-23
Information query