A substrate processing apparatus includes a rotating unit rotating a substrate around a predetermined first rotational axis passing through a central portion of a major surface of the substrate, a nozzle provided to be circumrotatable around a predetermined second rotational axis, discharging a processing fluid toward the major surface of the substrate, and having a plurality of discharge ports disposed at positions separated from the second rotational axis, a processing fluid supplying unit supplying the processing fluid to the plurality of discharge ports, and a nozzle moving unit moving the nozzle between a central portion processing position and a peripheral edge portion.