Invention Grant
- Patent Title: Planarizing processing method and planarizing processing device
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Application No.: US16227270Application Date: 2018-12-20
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Publication No.: US10665480B2Publication Date: 2020-05-26
- Inventor: Eisuke Suzuki , Kazuto Yamauchi , Tatsutoshi Suzuki , Daisuke Suzuki
- Applicant: TOHO ENGINEERING CO., LTD. , OSAKA UNIVERSITY
- Applicant Address: JP Suita-Shi, Osaka JP Yokkaichi-Shi
- Assignee: OSAKA UNIVERSITY,TOHO ENGINEERING CO., LTD.
- Current Assignee: OSAKA UNIVERSITY,TOHO ENGINEERING CO., LTD.
- Current Assignee Address: JP Suita-Shi, Osaka JP Yokkaichi-Shi
- Agency: J-Tek Law PLLC
- Agent Jeffrey D. Tekanic; Scott T. Wakeman
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7fe6b4cb
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/302 ; H01L21/306 ; H01L29/16 ; B01J23/42 ; B01J35/02 ; H01L21/02 ; H01L29/20

Abstract:
A method for planarizing a workpiece includes bringing a surface of the workpiece and a surface of a pad having a catalyst layer at least on the surface thereof into contact with or proximal to each other, rotating a first one of the workpiece and the pad in a plane of the surface of the first one around a central axis that intersects the surface of the first one while supplying a liquid that supports a catalytic reaction between the surface of the workpiece and the catalyst layer on the surface of the pad, and simultaneously reciprocally moving a second one of the workpiece and the pad in a direction parallel to the surface of the second one by at least an amount that makes possible planarization of the surface of the workpiece based on the catalytic reaction.
Public/Granted literature
- US20190122904A1 PLANARIZING PROCESSING METHOD AND PLANARIZING PROCESSING DEVICE Public/Granted day:2019-04-25
Information query
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