Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing system, and substrate processing method
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Application No.: US15305088Application Date: 2015-04-17
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Publication No.: US10665487B2Publication Date: 2020-05-26
- Inventor: Itsuki Kobata , Keita Yagi , Katsuhide Watanabe , Yoichi Shiokawa , Toru Maruyama , Nobuyuki Takahashi
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: BakerHostetler
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@16e0d561
- International Application: PCT/JP2015/061848 WO 20150417
- International Announcement: WO2015/159973 WO 20151022
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/3105 ; H01L21/683 ; H01L21/306 ; H01L21/321 ; H01L21/67 ; B24B37/20 ; H01L21/311 ; H01L21/3213 ; B24B37/04 ; H01L21/66
Abstract:
An object of the present invention is to improve a substrate processing apparatus using the CARE method.The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.
Public/Granted literature
- US20170047237A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM. AND SUBSTRATE PROCESSING METHOD Public/Granted day:2017-02-16
Information query
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