Invention Grant
- Patent Title: Controlling active fin height of FinFET device using etch protection layer to prevent recess of isolation layer during gate oxide removal
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Application No.: US16011864Application Date: 2018-06-19
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Publication No.: US10665514B2Publication Date: 2020-05-26
- Inventor: Yi Song , Veeraraghavan S. Baskar , Jay W. Strane , Ekmini Anuja De Silva
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Vazken Alexanian
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/311 ; H01L27/092 ; H01L21/3105 ; H01L29/66

Abstract:
Semiconductor devices and methods are provided to fabricate fin field-effect transistor (FinFET) devices having uniform fin height profiles. For example, uniformity of fin height profiles for FinFET devices is obtained by implementing a gate oxide removal process which is designed to prevent etching of an isolation layer (e.g., a shallow trench isolation layer) formed of an oxide material during removal of, e.g., sacrificial gate oxide layers of dummy gate structures during a replacement metal gate process.
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