Invention Grant
- Patent Title: Lead frame and semiconductor device
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Application No.: US16178779Application Date: 2018-11-02
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Publication No.: US10665533B2Publication Date: 2020-05-26
- Inventor: Kesayuki Sonehara , Muneaki Kure , Yosuke Aruga
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP
- Assignee: Shinko Electric Industries, Co., Ltd.
- Current Assignee: Shinko Electric Industries, Co., Ltd.
- Current Assignee Address: JP
- Agency: Tarolli, Sundheim, Covell & Tummino LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@25603c72
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L23/29 ; H01L21/48

Abstract:
A lead frame includes a conductive member, a plating layer, and an oxide film. The conductive member includes a rough surface. The plating layer is formed on the rough surface and configured to be connected to a semiconductor element. The oxide film covers the rough surface at least around the plating layer.
Public/Granted literature
- US20190157196A1 LEAD FRAME AND SEMICONDUCTOR DEVICE Public/Granted day:2019-05-23
Information query
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