A fan-out semiconductor package includes: a frame, including a wiring layer, and having a through-hole; a semiconductor chip disposed in the through-hole, and including a connection pad; an encapsulant covering at least a portion of each of the frame and an inactive surface of the semiconductor chip, and having a first opening exposing at least a portion of the wiring layer; an insulating layer disposed on the encapsulant, and having a second opening formed in the first opening to expose at least a portion of the wiring layer; a conductive pattern layer disposed on the insulating layer; a conductive via disposed in the second opening; and a connection structure disposed on the frame and an active surface of the semiconductor chip, and including one or more redistribution layers. The conductive pattern layer and the redistribution layer are electrically connected to the connection pad.