Invention Grant
- Patent Title: Semiconductor structure and method for forming the same
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Application No.: US15949368Application Date: 2018-04-10
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Publication No.: US10665597B2Publication Date: 2020-05-26
- Inventor: Shin-Hung Li
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@35605af8
- Main IPC: H01L27/112
- IPC: H01L27/112 ; H01L23/525

Abstract:
A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate, a resistive random access memory cell, and a semiconductor element. The resistive random access memory cell is on the substrate. The resistive random access memory cell includes a first electrode having a U shape. The semiconductor element is adjoined with an outer sidewall of the first electrode.
Public/Granted literature
- US20190279994A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2019-09-12
Information query
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