Invention Grant
- Patent Title: Silicon carbide semiconductor device and method of manufacturing a silicon carbide semiconductor device
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Application No.: US15993336Application Date: 2018-05-30
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Publication No.: US10665668B2Publication Date: 2020-05-26
- Inventor: Yusuke Kobayashi , Naoyuki Ohse , Shinsuke Harada , Takahito Kojima
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: Rabin & Berdo, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7c1d1205
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/16 ; H01L29/78 ; H01L29/66 ; H01L29/10 ; H01L21/04 ; H01L29/08

Abstract:
A vertical MOSFET having a trench gate structure includes an n−-type drift layer and a p-type base layer formed by epitaxial growth. In the n−-type drift layer, an n-type region, an upper second p+-type region, a lower second p+-type region and a first p+-type region are provided. The lower second p+-type region is provided orthogonal to a trench, and a total mathematical area regions that are between the first p+-type region and the p-type base layer and that include the n-type region is at least two times a total mathematical area of regions that are between the first p+-type region and the p-type base layer and that include the upper second p+-type region.
Public/Granted literature
- US20180358430A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2018-12-13
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