Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US16041894Application Date: 2018-07-23
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Publication No.: US10665713B2Publication Date: 2020-05-26
- Inventor: Takaaki Tominaga , Yasushi Takaki , Yoichiro Tarui , Shiro Hino
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3dc8a28d com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4e9b4184
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/417 ; H01L49/02 ; H01L29/16

Abstract:
A silicon carbide semiconductor device includes a silicon carbide semiconductor substrate having an n-type drift layer, and a p-type well region formed in a surface portion of a part of the drift layer, an insulating film provided on the well region, a gate built-in resistor formed of polysilicon in contact with a surface of the insulating film, an interlayer insulating film formed on the gate built-in resistor, a gate contact wire that is connected to a gate pad and formed on the interlayer insulating film, a gate wire provided on the interlayer insulating layer so as to be apart from the gate contact wire, a first gate contact for electrically connecting the gate contact wire and the gate built-in resistor, and a second gate contact for electrically connecting the gate wire and the gate built-in resistor.
Public/Granted literature
- US20190097043A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2019-03-28
Information query
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