Invention Grant
- Patent Title: Infrared light receiving device, method for fabricating infrared light receiving device
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Application No.: US16276402Application Date: 2019-02-14
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Publication No.: US10665736B2Publication Date: 2020-05-26
- Inventor: Daisuke Kimura , Sundararajan Balasekaran
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Smith, Gambrell & Russell, LLP.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5f380297
- Main IPC: H01L31/0352
- IPC: H01L31/0352 ; H01L31/18 ; H01L31/0304 ; H01L31/042 ; H01L31/109

Abstract:
An infrared light receiving device includes: a structure having a supporting base and a laminate body, the laminate body including a first superlattice layer, a second superlattice layer and a semiconductor region, the first superlattice layer, the second superlattice layer and the semiconductor region being arranged sequentially on the supporting base, and the laminate body having an array of semiconductor mesas for photodiodes and a recess defining the array of semiconductor mesas; and a first electrode connected to the first superlattice layer. The first superlattice layer has an n-type conductivity. The semiconductor region has a p-type conductivity. The first superlattice layer has a type-II superlattice structure and forming a heterojunction with the supporting base. The recess has first and second recess portions. The second recess portion has a bottom in the first superlattice layer. The first recess portion has a depth larger than that of the second recess portion.
Public/Granted literature
- US20190259891A1 INFRARED LIGHT RECEIVING DEVICE, METHOD FOR FABRICATING INFRARED LIGHT RECEIVING DEVICE Public/Granted day:2019-08-22
Information query
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