Invention Grant
- Patent Title: Programmable metallization cell with alloy layer
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Application No.: US16077760Application Date: 2016-03-31
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Publication No.: US10665781B2Publication Date: 2020-05-26
- Inventor: Elijah V. Karpov , Jeffery D. Bielefeld , James S. Clarke , Ravi Pillarisetty , Uday Shah
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- International Application: PCT/US2016/025437 WO 20160331
- International Announcement: WO2017/171821 WO 20171005
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
An embodiment includes a programmable metallization cell (PMC) memory comprising: a top electrode and a bottom electrode; a metal layer between the top and bottom electrodes; and a solid electrolyte (SE) layer between the metal layer and the bottom electrode; wherein (a) the metal layer includes an alloy of first and second metals, and (b) metal ions from the first metal form a conductive path in the SE layer when the top electrode is positively biased and disband the conductive path when the top electrode is negatively biased. Other embodiments are described herein.
Public/Granted literature
- US20190058115A1 PROGRAMMABLE METALLIZATION CELL WITH ALLOY LAYER Public/Granted day:2019-02-21
Information query
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