A method for manufacture of a gold-plated slipring contact, comprising steps of galvanic deposition of a copper layer on the electrically-conductive substrate; of a nickel and/or nickel phosphor layer on the copper layer; and of a gold layer on the nickel and/or nickel phosphor layer. While galvanically applying the copper layer on the substrate, the used galvanic bath explicitly does not include at least one of 3-carboxy-1-(phenylmethyl)pyridinium chloride sodium salt, cationic polymers with urea groups, 1-(3-sulfopropyl)pyridinium betaine, 1-(2-hydroxy-3-sulfopropyl)-pyridinium betaine, propargyl(3-sulfopropyl)ether sodium salt, sodium saccharin, sodium allylsulfonate, N,N-dimethyl-N-(3-cocoamidopropyl)-N-(2-hydroxy-3-sulfopropyl)ammonium betaine, polyamines, 1H-imidazole-polymer with (chloromethyl)oxiran, 3-carboxy-1-(phenylmethyl)pyridinium chloride sodium salt, 1-benzyl-3-sodium carboxy-pyridinium chloride, arsenic trioxide, potassium antimony tartrate, potassium tellurate, alkali arsenite, potassium tellerite, potassium seleno cyanate, alkali antimonyl tartrate, sodium selenite, thallium sulfate, and carbon disulfide, to create the outer surface of the contact that is at least an order of magnitude rougher than a surface of a conventionally-fabricated contact.