Invention Grant
- Patent Title: Binding structure of wire routing material
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Application No.: US16598389Application Date: 2019-10-10
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Publication No.: US10666034B2Publication Date: 2020-05-26
- Inventor: Atsushi Tokunaga , Katsuya Hirakawa , Shinji Oshita , Itsuo Wakabayashi , Kazunori Takata
- Applicant: DAIWA KASEI INDUSTRY CO., LTD. , TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: JP Okazaki-Shi, Aichi JP Toyota-Shi, Aichi-Ken
- Assignee: DAIWA KASEI INDUSTRY CO., LTD.,TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: DAIWA KASEI INDUSTRY CO., LTD.,TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Okazaki-Shi, Aichi JP Toyota-Shi, Aichi-Ken
- Agency: McClure, Qualey & Rodack, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@50e0e718
- Main IPC: B60R16/02
- IPC: B60R16/02 ; H02G3/32 ; F16G11/00 ; H01B7/00

Abstract:
Provided is a binding structure of a wire routing material which can allow reduction of cost and also provides excellent workability for assembly into a vehicle body when wiring for wire routing materials having different shapes, such as a wire harness and a flat wire routing material, is performed in the vehicle body. A binding structure 1 is formed in which a flexible wire routing material 2 and a plate-shaped flat wire routing material 3 having higher rigidity than the flexible wire routing material 2 overlap each other, and the flexible wire routing material 2 and the flat wire routing material 3 are enclosed in an annular form, bound, and held by a binding portion 45 of an engaging member 4 including an engaging portion 40 for assembly into the vehicle body.
Public/Granted literature
- US20200119536A1 BINDING STRUCTURE OF WIRE ROUTING MATERIAL Public/Granted day:2020-04-16
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