Invention Grant
- Patent Title: Solid-state imaging apparatus and electronic equipment
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Application No.: US16315343Application Date: 2017-07-07
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Publication No.: US10666284B2Publication Date: 2020-05-26
- Inventor: Atsumi Niwa
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2d28c6de
- International Application: PCT/JP2017/024891 WO 20170707
- International Announcement: WO2018/016344 WO 20180125
- Main IPC: H03M1/12
- IPC: H03M1/12 ; H03M1/56 ; H04N5/374 ; H04N5/378

Abstract:
The present disclosure relates to a solid-state imaging apparatus and electronic equipment which can realize operation with lower power consumption in a sensing mode. A solid-state imaging apparatus has an A/D conversion unit that A/D converts a pixel signal and an oscillator that generates a second internal clock with a frequency lower than that of a first internal clock obtained by multiplying an external clock, in which the A/D conversion unit is configured to operate, when operating by the second internal clock, with resolution lower than resolution of A/D conversion when operating by the first internal clock. The present disclosure can be applied to, for example, a CMOS image sensor.
Public/Granted literature
- US20190260385A1 SOLID-STATE IMAGING APPARATUS AND ELECTRONIC EQUIPMENT Public/Granted day:2019-08-22
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