Invention Grant
- Patent Title: Module isolation
-
Application No.: US16288427Application Date: 2019-02-28
-
Publication No.: US10666845B2Publication Date: 2020-05-26
- Inventor: Himay Shukla , Kielan Crow , Pascal Gohl
- Applicant: GoPro, Inc.
- Applicant Address: US CA San Mateo
- Assignee: GoPro, Inc.
- Current Assignee: GoPro, Inc.
- Current Assignee Address: US CA San Mateo
- Agency: Young Basile Hanlon & MacFarlane, P.C.
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H04N5/232 ; G03B17/56

Abstract:
In one aspect of the present disclosure, a module is disclosed for use with a digital image capturing device (DICD) including an integrated sensor-lens assembly (ISLA). The module includes a cradle configured for connection to a housing of the DICD, and at least one dampener that is configured for positioning between the module and the housing of the DICD to reduce vibrations transmitted to the ISLA.
Public/Granted literature
- US20200036873A1 MODULE ISOLATION Public/Granted day:2020-01-30
Information query