Invention Grant
- Patent Title: Manufacturing apparatus for performing additive manufacturing of an electrical device
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Application No.: US15512101Application Date: 2014-09-19
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Publication No.: US10667403B2Publication Date: 2020-05-26
- Inventor: Masato Suzuki , Akihiro Kawajiri , Masatoshi Fujita , Kenji Tsukada , Yoshitaka Hashimoto
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu-shi
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2014/074829 WO 20140919
- International Announcement: WO2016/042657 WO 20160324
- Main IPC: H05K3/00
- IPC: H05K3/00 ; B33Y30/00 ; B33Y10/00 ; B22F3/105 ; B29C67/00 ; H05K3/12 ; H05K1/09 ; H05K3/46 ; B33Y80/00 ; B23P21/00 ; H05K3/10

Abstract:
A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.
Public/Granted literature
- US20170280567A1 MANUFACTURING APPARATUS AND MANUFACTURING METHOD Public/Granted day:2017-09-28
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