Invention Grant
- Patent Title: Contacting arrangement and method for forming the contacting arrangement
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Application No.: US16242692Application Date: 2019-01-08
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Publication No.: US10667409B2Publication Date: 2020-05-26
- Inventor: Heiner Jacobs , Martin Rittner , Ulrich Kessler
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Norton Rose Fulbright US LLP
- Agent Gerard Messina
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1245d11b
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01G4/228 ; H01R12/58 ; H05K1/18
Abstract:
A contacting arrangement between an electrical component and a circuit carrier, the component being connected to a connection element formed as a part separate from the component, and the connection element being electroconductively contacted directly with the circuit carrier via at least one press-fit connection.
Public/Granted literature
- US20190215969A1 CONTACTING ARRANGEMENT AND METHOD FOR FORMING THE CONTACTING ARRANGEMENT Public/Granted day:2019-07-11
Information query
