Invention Grant
- Patent Title: Immersion cooling system for data centers
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Application No.: US16028356Application Date: 2018-07-05
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Publication No.: US10667427B2Publication Date: 2020-05-26
- Inventor: Tianyi Gao
- Applicant: Baidu USA LLC
- Applicant Address: US CA Sunnyvale
- Assignee: BAIDU USA LLC
- Current Assignee: BAIDU USA LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Embodiments of the invention provide a system design for immersion cooling. The design utilizes a single cooling loop design. An external cooling unit, such as an indirect evaporative cooling (IDEC) system, is utilized to transfer the heat to the atmosphere from the cooling loop. The fluid in the cooling loop is driven by a centralized pump or pumps and the local pumps. The fluid is supplied to the immersion cooling rack or device. The design introduces several innovations on the cooling loop infrastructure by adding heat recovery system. Under different operating conditions, both the heat recovery system and external cooing unit can be connected into or bypassed from the main immersion cooling loop. At least some of the advantages include simplified infrastructure, a total system solution, high reliability, fast deployment, feasible system operation adjustment, cost reduction, and high operating efficiency.
Public/Granted literature
- US20200015383A1 IMMERSION COOLING SYSTEM FOR DATA CENTERS Public/Granted day:2020-01-09
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