Invention Grant
- Patent Title: Heat spreader to structurally support an outer housing
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Application No.: US16091023Application Date: 2016-07-06
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Publication No.: US10667432B2Publication Date: 2020-05-26
- Inventor: Timothy J Sutherland
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Thorpe, North & Western
- International Application: PCT/US2016/041080 WO 20160706
- International Announcement: WO2018/009178 WO 20180111
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/20 ; G12B15/06 ; G06F1/20 ; H05K5/03 ; G06F1/16 ; H01Q7/00

Abstract:
In some examples, an electronic device includes an outer housing and a heat spreader inside an inner chamber defined by the outer housing. The heat spreader is structurally engaged to the outer housing to provide structural support for the outer housing, and the heat spreader is to spread heat along two different directions. Electronic components are in thermal contact with a surface of the heat spreader to transfer heat produced by the electronic components to the heat spreader.
Public/Granted literature
- US20190132993A1 HEAT SPREADER TO STRUCTURALLY SUPPORT AN OUTER HOUSING Public/Granted day:2019-05-02
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