Invention Grant
- Patent Title: Hybrid diamond-polymer thin film sensors and fabrication method
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Application No.: US16301915Application Date: 2017-05-26
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Publication No.: US10667709B2Publication Date: 2020-06-02
- Inventor: Wen Li , Bin Fan , Robert Rechenberg , Michael Becker , Cory Rusinek
- Applicant: Board of Trustees of Michigan State University , Fraunhofer USA
- Applicant Address: US MI East Lansing US MI East Lansing
- Assignee: Board of Trustees of Michigan State University,Fraunhofer USA
- Current Assignee: Board of Trustees of Michigan State University,Fraunhofer USA
- Current Assignee Address: US MI East Lansing US MI East Lansing
- Agency: Harness, Dickey & Pierce, PLC
- International Application: PCT/US2017/034745 WO 20170526
- International Announcement: WO2017/205781 WO 20171130
- Main IPC: H01L21/78
- IPC: H01L21/78 ; B23K26/53 ; A61B5/04 ; H01L21/02 ; H01L21/033 ; H01L21/04 ; H01L21/3065 ; H01L21/3213 ; B81B3/00 ; B81B7/00
Abstract:
An implantable device is provided. The implantable device includes a flexible polymeric substrate that extends through an aperture in an electrically conductive material to form an anchor that partially covers the electrically conductive material. Methods for fabricating the implantable device are also provided.
Public/Granted literature
- US20190282110A1 Hybrid Diamond-Polymer Thin Film Sensors And Fabrication Method Public/Granted day:2019-09-19
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